Global Label Adhesives Market Market Professional Survey Report 2017 - Analysis, Competitive Landscape, and Forecasts to 2022

Validus Reports has recently added a new study titled Label Adhesives Market Market of the World - Competitive Landscape, Industry Statistics, and Forecasts to 2022 - Market Research Report. This report studies Label Adhesives in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2012 to 2016, and forecast to 2022.

Interested to know more about this report? Write to us at sales@validusreports.com

This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering

PPG Industries

Akzo Nobel

Avery Dennison

Henkel

3M

Bostik S.A

H.B Fuller

The Dow Chemical Company

Herma

UPM Raflatac

Ashland Global Holdings

Lintec Corporation

ITL Apparel Label Solution

Pacific Adhesives

Jubilant Industries

Okil Sato

ITW

Adhesive Labels Company

Mr Forecasts to 2022 Label Co.

Etiquette Labels

Hamilton Adhesive Labels

Samsun Label Printing

Rako-Etiketten GmbH

Cimaron Label

Super Label Mfg.Co



On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

Water-based

Hot Melt-based

Solvent-based

Other



By Application, the market can be split into

Metal Application

Glass Application

Plastic Application

Fibre Application

Other



By Regions, this report covers (we can add the regions/countries as you want)

North America

China

Europe

Southeast Asia

Japan

India

About Validus Reports:
Validus Reports is a market research aggregator bringing you the most comprehensive research studies, in time and at the International Label Adhesives Market Market best prices.

Contact Us:
In case of additional questions and best prices, write to:
Mr. Trevor Cherian
sales@validusreports.com

Leave a Reply

Your email address will not be published. Required fields are marked *